ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,577, issued on Sept. 22, was assigned to SPTS Technologies Ltd. (Newport, Great Britain). "Method of operating a PVD apparatus" was invent... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,578, issued on Sept. 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Ion implantation for increased adhesion with resis... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,579, issued on Sept. 22, was assigned to DISCO Corp. (Tokyo). "Processing method of bonded wafer" was invented by Hayato Tanaka (Tokyo) an... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,580, issued on Sept. 22, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Self-aligned litho-etch-litho-etch mandrel... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,581, issued on Sept. 22, was assigned to Canon K.K. (Tokyo). "Wafer dicing method and liquid ejection head" was invented by Takashi Teraga... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,582, issued on Sept. 22, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Method of cleaning silicon wafer, method of manufacturing s... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,583, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,584, issued on Sept. 22, was assigned to HANWHA PRECISION MACHINERY Co. LTD. (Changwon-si, South Korea). "Modularized bonding apparatus" w... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,585, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Wafer cleaning method and system using heated functional plate" was... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,586, issued on Sept. 22, was assigned to EBARA Corp. (Tokyo). "Substrate processing method and substrate processing apparatus" was invente... और पढ़ें